4PCS Universal BGA Stencil For MTK MSM Samsung Huawei Xiaomi IPad CPU RAM PM Power IC Reball Pin Direct Heat Template

KSh 1,282

KSh 2,13640%

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+ shipping from KSh 260 to CBD - UON/Globe/Koja/River Road

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Delivery Fees KSh 260

Ready for pickup between 08 May and 10 May if you place your order within the next 2hrs 43mins

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Delivery Fees KSh 380

Ready for delivery between 08 May and 10 May if you place your order within the next 2hrs 43mins

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Product details

for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM
100% The product is new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel

Package Contents:
4 x BGA Reballing Stencils

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.